ABOUT
THE CPFC
The Canadian Photonics Fabrication Centre (CPFC) is a
national technology center offering commercial grade
foundry and device fabrication services in III-V
semiconductor and silicon-based materials, for the
prototyping and pilot-line production runs of customized
optoelectronic and photonic devices.
Financially supported by the Canadian government, the
province of Ontario, and in partnership with the Carleton
University, the CPFC provides reliable, cost-effective
prototyping solutions for industry and research centers
across Canada and around the world.
The CPFC leverages NRC's world-class research and
development infrastructure, incubation facilities, and the
CPFC's commercial manufacturing experienced staff. By
reducing the risk of technology development and investment,
the CPFC will also reduce time-to-market and provide
companies with a unique competitive edge.
Products
& Services
- The
CPFC provides both active and passive photonic device
solutions for applications in life sciences,
communications, environmental, defense/security, and
energy sectors.
EPITAXY
- MOCVD
- Metal Organic Chemical Vapor Deposition including InP,
GaInAsP, GaAs, GaAlAs, InGaAlAs
CV DEPOSITIONS - PECVD
- Plasma Enhanced Chemical Vapor Deposition of oxinitride
(refractive index tuning and stress tuning), Oxide,
Nitride, Doped Oxides (P, B, Ge etc.)
- LPCVD
- Low Pressure Chemical Vapor Deposition of poly-silicon
- Thermally
grown oxide up to 15 micron
THIN FILM PV DEPOSITION - Design
and modeling of coatings
- Sputtering,
evaporation, ion plating, and electro plating techniques
- Provide
AR and HR coatings
- Facet
coatings, mirrors, filters etc.
- Special
materials including ITO
- Wafers
or chips
LITHOGRAPHY
- Direct write 50 KV e-beam (resolution down to 0.015 micron with 20 nm min. feature size. Placement and overlay accuracy of 30 nm, field stitching to 20 nm.
- Patterning
of 2 to 4 inch wafers and chips, fabrication of 4 inch
specialty masks)
- Sub
micron stepper capable of .4 micron resolution (with 70
nm overlay)
- Nano-imprinter
- Contact
Aligners (backside and front capable).
- Holography
tables for gratings
DRY ETCHING - Deep
RIE of silicon (ICP plasma source, cryogenic cooling)
- Deep
RIE of oxides
- RIE of
dielectrics
- ICP
etching of III-V materials
WET ETCHING - Segregated
multiple manual wet benches (Si and III-V) processing
- Automated
single side etch
- Selective
and non selective wet etch chemistries
INSPECTION & CONTROLS - Optical
Microscopy
- Scanning
Electron Microscopy (SEM)
- Atomic
Force Microscopy (AFM)
- Surface
profiling (contact/non-contact)
- Ellipsometry
- Stress
measurement
- Nomarski
surface inspection
- Surfscan
(TM) for defect counting and mapping
CHARACTERIZATION
- PL and
reflectance mapping
- Electrochemical
(Polaron) profiling
- Hall
effect for carrier concentration and mobility
- Double
crystal X-Ray diffraction
- XPS,
TEM, EDX, STEM
- AUGER,
SIMS
BACK END PROCESSING - Gold
electroplating
- Wafer
thinning and polishing <100 um
- Front
side identification
- Sputter
deposition and anneal of backside metals
- Full
wafer dismount and cleaning
- Scribe
and cleave, sawing and dicing
- AR
Dielectric facet coating
- Die
bond and wire-bond
- Packaging
(Via 3rd party alliances)
DESIGN & TESTING - Optical
performances
- Electrical
characterization
- Frequency
and RIN response
- Quantum
efficiency
- Spectral
response
- Thermal
properties
- Gain
analysis
- Transparency
& cavity loss measurement
- Semiconductor
parameter analysis
- Device
level modeling
CONTACT: For more information on how the CPFC can address your product or process development needs, please visit the CPFC web site at www.cpfc.ca.